Crystal Blank

Aspire for the worlds smallest crystal blank

Crystal Blank

Brief overview

Our crystal blank is piezoelectric and cut into prescribed shape and angle depending upon the crystal axis. There are various kinds of crystal oscillators and each crystal oscillator uses a different crystal blank that has a different frequency, and electrical performance.
Thickness and overall size of the crystal blank are important factors to define characteristic features of the crystal oscillator.
The relationship between thickness of crystal blank and crystal oscillator is that the higher frequency of the crystal oscillator, the thicker the crystal blank is and vice versa.
Crystal Blank

Purpose

Communication devices such as cell phones, computer related devices, digital appliances. Audio-visual equipments, automobiles, etc.
Purpose

Specification

MTEC uses the most common crystal AT-cut to produce crystal blanks.
Artificial crystal standard cutting angular accuracy is plus minus 7.5awxibs ~ plus minus 2 minute.

Specification

Features

MTEC produces small crystal blanks for SMD crystal units and high frequency wave polish blanks. We excel at surface reformulation process, such as bevel process and polish process. We produce high electrical characteristic crystal blanks.

Bevel Process
Bevel process is the way of the molding process to polish and reprocess by spinning crystal tips.

Polish Process
Polish process is used to polish surface of crystal blank to a mirror gloss.
Friction is likely to be created on the surface of mirrored crystal blanks. Therefore, we require high process skill to prevent stress-stain from the polish process.

Processing Technology of MTEC

Products Line-up

Package size 7050 3225 2520 2016
Item [MHz] 3rd

155.520
156.250
164.328
187.468
190.000
195.000
200.000
212.500		 1st

16.000
16.384
19.200
20.000
24.000
26.000
32.000
40.000		 1st

20.000
25.000
26.000
27.000
32.000
36.000
38.400
40.000		 1st

22.000
24.000
26.000
27.000
32.000
38.400
40.000
44.000
AT-cut plus minus 7.5awxibs ~ plus minus 2 minute
Main blank size 4.4×1.8 2.0×1.3 1.6×1.1 1.3×0.9
Surface finish #4000 Etching
Polish Process		 #4000 Etching
Polish Process
Bevel Process		 #4000 Etching
Polish Process
Bevel Process		 #4000 Etching
Polish Process
Bevel Process

Major Facility

Polish equipment
9B／9.6B／6B／6.4B／4B／4.3B
Cutoff equipment
Multi wire saw machine
Process equipment
High-speed bevel process equipment
Surface processing devices
Automatic etching treatment equipment
Inspection devices
Automatic frequency classificatory devices, Manual frequency measuring machine, Bevel figure measure, Microscope, Profile projector, Surface roughness measure, X-ray automatic angular measure.